Cushion Material for Printed Circuit Board Manufacturing "ACE BOARD C Series"
Recommended for CEM-1, CEM-3, and FR-1 substrates! Supports automatic transport through suction.
The "ACE BOARD C Series" is a cushioning material for printed circuit board manufacturing that can be used at a press temperature of 200°C. It has the properties of both cushioning and thermal conductivity, making it reusable. You can select an appropriate cushioning material. Please feel free to consult us when needed. 【Features】 ■ Combines cushioning and thermal conductivity ■ Usable at a press temperature of 200°C ■ Reusable ■ Compatible with automatic transport through adhesion *For more details, please refer to the PDF document or feel free to contact us.
- Company：イチカワテクノファブリクス
- Price：Other
